Environmental Impact Substances Management Policy Statement
To coordinate between economic development and environmental protection, to build word-wide green supply-chain and to realize the sustainable development of human beings have become a world consensus on understanding of environment. Based on the reasons and motives of environmental protection, many countries and regions issue environmental standards, laws and regulations, requiring the enterprises to undertake responsibilities, which play an important role in both environmental protection and economic growth.
Relying on QC080000 Hazardous Substance Process Management (HSPM) System, Leshan Radio Co., Ltd (LRC) attaches great importance on environmental protection of the earth, proactively responds and pushes Clean Production project, overall implements effective methods and technology of Environmental Impact Substances Management and ensure its product design, material composition, manufacturing process and sales to comply with international and domestic laws, regulations and customer requirements
LRC initiated hazardous substance process management system to evaluate and certify the adoption of RoHS requirements in our products in early 2009 and currently all of our products meet requirements of the scope of Directive 2011/65/EU issues on Jan 1, 2013.We are committed to provide information about substances in our products as required and will constantly monitor and follow other environmental directives. In this way, our customer needs can be met in a timely manner. Should you have any inquiries for more information, please feel free to visit our website by searching part number for detailed material composition.
EU RoHS Directive Restricted Substance and Maximum PPM
|Markerd as Restricted Substance by EU RoHS compliance||PPM less than|
All of LRC product are pb-free lead finish.
The exemption declaration
|Technology||Package||Exemption Component||RoHS exemption||PPM less than|
|Diodes,Transistors,Bridge||Axial/Power SMD||GPP wafer||Electrical and electronic components containing lead in a glass|| 5 –Lead in glass of cathode ray tubes,electronic |
components and fluorescent tubes.
|Plastic sealed diodes(GPP &GPRC Chip)||Axial/Power SMD||Welding sheet, Solder paste|| |
85% High melting tin-lead alloy containing 85% by weight or more lead)
| 7.1--- lead in high melting temperature type solders |
(i.e.tin-lead solder alloys containing than 85%)
Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.
Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.
For further explanation on material composition calculations, please contact your local LRC sales or LRC quality service contact window (email@example.com).